Expanded Product List
Master Bond Product Search
114 products match
 |
EP3RRLV One part oven cured system (125-150°C) for potting, encapsulation and underfill applications. Good dimension stability and very easy to use. Cures rigid. Thermally conductive/electrically insulative. Excellent flow properties. Superior mechanical strength. Can be cast up to 1 inch thick. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +350°F. |
 |
EP3SP5FL Single component snap cure adhesive. Unsurpassed curing speed of 1-2 minutes at 300°F. Moderate viscosity with good flow properties. Easy to dispense. Good tensile lap shear strength. Repairable. Serviceable from -60°F to +200°F. |
 |
EP3SP5FL-ND2 Snap cure epoxy adhesive. Paste viscosity. Cures in 1-2 minutes at 300°F. Readily reworkable. Good bond strength and electrical insulation properties. Serviceable from -60°F to +200°F. |
 |
EP3UF One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
 |
EP3UF-1 One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
 |
EP4CL-80 One component, ultra low viscosity epoxy that offers thermal and electrical insulation and is optically clear. |
 |
EP4CL-80Med One component, ultra low viscosity epoxy that offers thermal and electrical insulation and is optically clear. |
 |
EP4EN-80 One component, low viscosity epoxy that offers thermal conductivity, electrical insulation and a filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. |
 |
EP4G-80 Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes NASA low outgassing certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |
 |
EP4G-80Med Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes ISO 10993-5 certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |