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Master Bond Product Search
114 products match
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Supreme 17HTMed Master Bond Supreme 17HTMed is a one component toughened epoxy for bonding and sealing that meets ISO 10993-5 for biocompatibility. It has a moderate viscosity system with good flow properties.The service temperature range is from -100°F to +550°F. |
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Supreme 17HTND-2 Master Bond Supreme 17HTND-2 is a one component toughened epoxy for bonding and sealing. It is a paste system with good physical strength properties.The service temperature range is from -100°F to +550°F. |
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Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |
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Supreme 3 Storage stable one component heat curing epoxy adhesive. Versatile cure schedules. Electrically insulative. Durable system. Resists thermal cycling. Serviceable from -100°F to +250°F. |
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Supreme 3AN One part epoxy adhesive offers exceptional thermal conductivity. Good electrical insulating properties. Cures in 5-10 minutes at 300°F or 20-30 minutes at 250°F. Bonds withstand thermal cycling, vibration, stress fatigue cracking. Serviceable from -100°F to +250°F. |
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Supreme 3ANHT Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Thick paste viscosity. Shore D hardnes >75. Serviceable from -100°F to +350°F. |
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Supreme 3ANLV-1 Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Flowable viscosity. Shore D hardness 80-90. Serviceable from -100°F to +300°F. |
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Supreme 3AO Low temperature curing thermal conductive epoxy adhesive. Outstanding toughness and durability. Dimensional stability. Easy application. Gray color. Serviceable from -100°F to +300°F. |
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Supreme 3AOHT One component, fast heat curing system. Can withstand rigorous thermal cycling. Thermally conductive, electrically insulative. Paste viscosity. Serviceable up to 350°F. |
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Supreme 3CCM-85 One part epoxy system designed for glob tops and small encapsulation. Curing temperature 175-185°F for 2 to 3 hours. Toughened epoxy can withstand thermal cycling. Suitable for bonding and potting. Thermally conductive and electrically insulative. Service temperature range from -100°F to +350°F. |