Expanded Product List
Master Bond Product Search
630 products match
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EP3HTS-LO High performance, one component silver filled electrically conductive adhesive. Low volume resistivity. Bonds wells to a wide range of substrates. Meets NASA low outgassing requirements. Thermally conductive. Rapid cures at moderate temperatures. Easy to dispense. Serviceable from -60°F to +400°F. |
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EP3HTS-TC Silver filled electrically conductive, for die attach and general bonding. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Thixotropic paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F. |
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EP3HTSCN Silver coating nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTSDA-1 Silver filled electrically conductive, die attach epoxy has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F. |
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EP3HTSDA-2 Silver filled electrically conductive epoxy has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive with incredibly low thermal resistance. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +450°F. |
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EP3HTSDA-2Med Silver filled electrically conductive epoxy has a rapid cure speed. Meets ISO 10993-5. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive with incredibly low thermal resistance. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +450°F. |
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EP3HTSMed One part, silver conductive epoxy adhesive. USP Class VI approved. Rapid cures at elevated temperatures. Thixotropic paste. Serviceable from -60°F to +400°F. High shear strength. Excellent thermal and electrical conductivity. Exceptionally low resistivity. |
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EP3LV One component heat curing epoxy adhesive. Outstanding dimensional stability. Does not contain any solvents or diluents. Superior tensile shear strength. Adhesive spreads evenly and smoothly. Easy to dispense. Thermal insulator. Serviceable from -100°F to +300°F. |
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EP3RR-1 Thermally conductive/electrically insulative epoxy formulation for potting/encapsulation and underfill applications. No mix system. Rapid curing with versatile cure schedules Good flow properties. Dimensionally stable. Available in syringes for manual or automatic dispensing. Serviceable from -60°F to +350°F. |
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EP3RR-80 Moderate viscosity with excellent flow properties. One part system featuring cures at 80°C or higher. Superior thermal conductor. Excellent electrical insulator. Low exotherm while curing. Outstanding mechanical strength properties. Withstands 1,000 hours 85°C/85% RH. Passes NASA low outgassing tests. Serviceable from -100°F to +350°F. |