Expanded Product List
Master Bond Product Search
71 products match
 |
EP51AO Rapid curing epoxy adhesive/sealant. Excellent thermal conductivity/electrical insulative properties. Fast set up time. Convenient one to one mix ratio by weight or volume. Serviceable from 4K to +250°F. Resists water, oil, fuels and many solvents. Superior heat dissipation characteristics. |
 |
EP51CC Easy to apply, paste like consistency two component epoxy adhesive. High bond strength. Can be packaged for use in field applications. Serviceable at cryogenic temperatures down to 4K. |
 |
EP51FL Tough, flexible epoxy adhesive cures rapidly at ambient temperatures. High bond strength. Cryogenically serviceable. Easy to use, one to one mix ratio. |
 |
EP51FL-1 Flexible epoxy adhesive has rapid set up time and cure speed. High peel strength and elongation. Withstands mechanical shock and vibration. Resists thermal cycling. Superb electrical insulation properties. Service operating temperature range from -100°F to +250°F. |
 |
EP51HT Service operating temperature range from 4K to +400°F. Fast room temperature curing epoxy adhesive/sealant. Gels in 5 minutes. Convenient one to one mixing ratio by weight. Bonds well to similar/dissimilar substrates. High tensile lap shear strength. |
 |
EP51M Rapid curing at room temperature. Fixturing period 7-12 minutes. Convenient one to one mix ratio by weight or volume. High bond strength and long term durability. Withstands 1,000 hours 85°C/85% RH. Serviceable from 4k to +250°F. Available in various viscosities and colors. |
 |
EP62-1LPSP Low viscosity, optically clear epoxy with superior electrical insulation properties. Thermal stability. Exceptional chemical resistance. Long working life. Low exotherm. Withstands 1,000 hours 85°C/85% RH. Meets NASA low outgassing specifications. Serviceable from 4K to +400°F. |
 |
EP62-1LPSPMed White Sterilization resistant, cryogenic ISO 10993-5 epoxy for medical device assembly. White pigment. Low viscosity. |
 |
EP75-1 Non-magnetic graphite conductive epoxy system. Useful lubricity. Exceptional dimensional stability. High bond strength properties. Superior durability. Volume resistivity 50-100 ohm-cm. Used in EMI/RFI shielding and static dissipation applications. Cost effective. Serviceable from -60°F to +250°F. |
 |
EP76M-F Fast setting nickel filled electrically conductive epoxy adhesive. Room temperature curing. Volume resistivity 5-10 ohm-cm. Serviceable from -60°F to +250°F. Convenient one to one mix ratio weight or volume. Paste consistency. Good resistance to chemicals. High bond strength. |